At cleocircuit we are understating the leading edge requirement for Front-end Engineering and according to that we have formed outsourcing structure to provide complete solutions with zero defect work. We will develop a long term Joint venture relation with customer and will work as per customer’s specific requirements. Our engineers follow customer’s Procedures, Specification, and Working Method to achieve their confidence and same platform.


  • full panelization for single sided, double sided and multi layer boards.
  • Generate drill and routing program from AutoCAD/DXF or Gerber files.
  • Error detection services/quality check
  • Data accepted by e-mail / ftp site.
  • Data in Gerber, RS-274X, DXF, PDF, HPGL, AutoCAD & ASCII or NC Drill formats are accepted.
  • Tools like ,Ucamco Ucam , and Genesis 2000 used.

We run an exhaustive list of design rule checks for all boards to avoid error that can possibly cause board scrap. All features are thoroughly checked for violations before the board is panellized.

Some of the checks are:
  • Mismatch between Fabrication Drawing and Gerber.
  • Separation between segments.
  • Minimum track width.
  • Open trace/Hanging traces.
  • Power to ground short detection.
  • Annular ring verification.
  • Distance between holes to copper segment.
  • Expose Trace.

We are running large number of DFM (Design for Manufacturability) actions on various layers, such as Signal, Solder Mask, Silk Screen layers to ensure productivity.

Some DFM operations that we carry out are:
    Analysis of Gerber data with Fab drawing:
  • Board outline dimensions.
  • Hole Size, Hole Count & Tolerances.
  • Stack up information, Finish type and Board thickness.
  • Special requirements for the Text and Logos.

  • Full fledged and dedicated CAM facility for the post processing of Gerber data (Pre Manufacturing)
  • 24/7 services to cater to the requirements of customers world wide
  • State of the art Software/Hardware and Communication infrastructure
  • Single layer to multi layer as per IPC standard
  • Surface mount, Ball Grid Array & Through hole designs with blind and buried vias
  • Split ground planes and power planes for mixed signals
  • High speed design, early analysis and design optimization
  • Post layout analysis for signal integrity, impedance match
  • Net list Analysis
  • Reliability Analysis
  • Thermal Analysis
  • Editing and Optimization
  • Rout and retain
  • Step and repeat with break-away tabs
  • Slots, Scoring, V-cuts, Routing
  • Tear dropping
  • Multiple circuit panelization
  • Creation of test coupons

  • Missing Hole, Extra Hole or Close Holes.
  • Touching Holes/Duplicate Holes.
  • Checking for 2nd drill option.
  • Minimum spacing between two conductors.
  • Minimum Track width.
  • Minimum Annular ring.
  • Drill/rout to conductor spacing.
  • Sliver.
  • Thermal air gap/spoke width.
  • Drill to copper plane spacing.
  • Plane shearing line width.
  • Mask annular ring for copper pad.
  • Expose trace.
  • Mask to copper spacing.
  • Legend width.

  • Gold Finger.
  • Controlled Impedance.
  • Via-plug, Peelable mask, Carbon Ink.
  • Flip flop panelization.
  • Flat Pad.
  • Flex & Flex Rigid.

  • Draws to flash.
  • Pad Registration.
  • NFP Removal
  • Redundant pad and line removal.
  • Line unification.
  • Countrization of self-intersecting polygons.
  • Sliver in acute angles.
  • SMD attributes.
  • Legend Detection.

  • Scripting – This enables the customer to acquire the necessary scripts they need for their productionrequirements in their Genesis system.
  • Hypertooling – This is a JAVA based program that can be developed to be used in UCAM to automate someroutinely tasks in tooling.
  • Tooling – This is accomplished through a pool of engineers who are able to process design data from datainput, perform cleanup, carry out DRC/DFM and board edits, and perform any tasks up to output.

  • Power ground optimization.
  • Signal layer optimization.
  • Teardrop creation.
  • Solder mask optimization.
  • Legend overlap.
  • Copper Balancing.
  • Etch Compensation.

  • NC Drill and rout programs.
  • After drill and before etching rout program for plated edges.
  • Second stage drill program.
  • Counter bore/Counter /sink.
  • Panel with Tab rout/Break out pips
  • Peck Drill/G85.
  • Control Depth Rout.
  • Score Program.
  • Tool path generation.
  • Cover layer and Stiffener programs.

  • Netlist comparison of IPC netlist and CAD data.
  • Netlist comparison with processed data and customer data.

  • Step and Repeat of Board on Large panel.
  • Venting pattern.
  • Tooling holes/Registration Targets/ Punch targets.
  • Coupons for Control Impedance jobs.
  • Compensation for lamination shrinkage.